Nano carbon copper foil

• Exceptional Thermal Conductivity: The nano carbon coating on the copper foil ensures efficient heat transfer, providing a reliable thermal pathway between heat-emitting components (e.g., CPUs, GPUs) and heat sinks. High thermal radiation efficiency converts heat energy into infrared radio frequency, enhancing heat dissipation.
• Enhanced Electrical Conductivity: The integration of carbon nanotubes improves electrical conductivity, making it suitable for applications requiring both thermal and electrical performance.
• Mechanical Strength and Durability: Carbon nanotubes reinforce the copper foil, providing high tensile strength and resistance to wear and tear.
• Corrosion and High-Temperature Resistance: The material is resistant to environmental degradation and can withstand temperatures exceeding 100°C, ensuring long-term reliability.
• EMI Shielding and ESD Protection: Provides effective electromagnetic interference shielding and electrostatic discharge protection, safeguarding sensitive electronic components.
• Flexibility and Ease of Use: Highly flexible and easy to process, eliminating the need for additional wrapping treatments. This reduces construction costs and material waste.
• Eco-Friendly and Compliant: RoHS compliant and UL94V0 flammability rated, ensuring safety and environmental responsibility.

Nano Carbon Copper Foil Thermal Conductive Tape is widely used in industries and devices requiring advanced thermal management and EMI shielding, including:

• Consumer Electronics: Smartphones, tablets, laptops, LCD/LED TVs, routers, and gaming consoles.
• Industrial Equipment: Microprocessors, control power supplies, communication stations, and LED lighting.
• Aerospace and Defense: Lightweight, durable, and high-performance thermal management solutions.
• Medical Devices: Electrode materials for biosensors and nerve stimulation.
• Automotive and IoT Devices: Heat dissipation in advanced electronics and sensors.

Why Choose Nano Carbon Copper Foil Thermal Conductive Tape?

• Superior Performance: Combines high thermal conductivity, EMI shielding, and mechanical strength in one solution.
• Cost Efficiency: Reduces material waste and simplifies installation processes.
• Wide Compatibility: Suitable for a broad range of applications across multiple industries.
• Reliability: Corrosion-resistant, high-temperature resistant, and environmentally compliant.

• High Thermal Conductivity: Ensures efficient heat transfer for optimal device performance.
• High Heat Capacity: Effectively manages heat in high-power applications.
• Cost-Effective: Reduces material loss and construction costs compared to alternatives like artificial graphite.
• Lightweight and Durable: Ideal for aerospace, defense, and medical applications.