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Low-Resistance Copper Foil Adhesive Tape

Copper Foil Tape

Composition of Low Resistance Copper Foil Tape

  • Copper Foil Substrate: Manufactured through advanced electrolytic refining processes, the base material utilizes premium-grade copper foils characterized by exceptional electrical conductivity and malleability. Thickness specifications typically range between 0.018mm and 0.05mm, enabling seamless adaptation to complex surface geometries while optimizing cost-efficiency and weight reduction in precision applications.
  • Conductive Adhesive Layer: Proprietary conductive acrylic-based adhesive formulations are embedded with uniformly dispersed metallic particles to establish low-resistance electrical pathways. This configuration ensures reliable current transmission across bonded interfaces without compromising structural integrity.
  • Release Liner: Consists of a polyester or silicone coated release liner that protects the adhesive layer during storage and handling.

Low-Resistance Copper Foil Adhesive Tape Features

  • Low resistance: It can provide a low resistance path for the current to ensure the stability and efficiency of signal transmission, and reduce the voltage drop and energy loss.
  • Enhanced Conductivity: Leverages superior conductive properties inherent to high-purity copper substrates, enabling seamless electron mobility critical for high-frequency and high-current applications.
  • Robust Adhesion: Proprietary adhesive technology delivers durable bonding across heterogeneous surfaces (metals, polymers, ceramics), maintaining cohesive strength under dynamic mechanical stress, thermal cycling, and humidity variations.
  • EMI/RFI Mitigation: Provides multi-spectrum electromagnetic shielding to attenuate interference across frequencies (EMI/RFI), preventing signal degradation from external sources while suppressing parasitic emissions from internal circuitry.
  • Flexibility: The overall flexibility of the tape can be adapted to different shapes and curvatures of the surface, easy to use in a variety of complex spaces.

Tips for Use:

  • Clean surfaces before application for better adhesion.
  • Solderable versions allow direct soldering for permanent fixes.
  • Overlap seams for continuous shielding in EMI applications.
  • Would you like recommendations for a specific use case?

Low-Resistance Copper Foil Adhesive Tape Applications

Applications:

  • Electronics Repair: Fixing PCB traces, shielding circuits, or bridging connections.
  • EMI/RFI Shielding: Enclosures, cables, or sensitive components in devices.
  • Grounding Straps: Dissipating static electricity in assemblies.
  • Antennas & RFID Tags: Enhancing signal transmission.
  • DIY Projects: Custom circuits, wearable electronics, or solar panel repairs.

Considerations When Choosing:

  • Resistance: Verify ohms per square (Ω/sq) for your application.
  • Adhesive Type: Conductive adhesive for electrical continuity; non-conductive for isolation.
  • Thickness: Thicker foils (e.g., 50µm–100µm) offer lower resistance but less flexibility.
  • Oxidation Protection: Bare copper oxidizes; tinned/nickel-plated versions last longer.
  • Temperature Range: Check adhesive stability (e.g., -40°C to +120°C for some tapes).

Other Copper Foil Tapes

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