Copper Foil Substrate: Manufactured through advanced electrolytic refining processes, the base material utilizes premium-grade copper foils characterized by exceptional electrical conductivity and malleability. Thickness specifications typically range between 0.018mm and 0.05mm, enabling seamless adaptation to complex surface geometries while optimizing cost-efficiency and weight reduction in precision applications.
Conductive Adhesive Layer: Proprietary conductive acrylic-based adhesive formulations are embedded with uniformly dispersed metallic particles to establish low-resistance electrical pathways. This configuration ensures reliable current transmission across bonded interfaces without compromising structural integrity.
Release Liner: Consists of a polyester or silicone coated release liner that protects the adhesive layer during storage and handling.
Low-Resistance Copper Foil Adhesive Tape Features
Low resistance: It can provide a low resistance path for the current to ensure the stability and efficiency of signal transmission, and reduce the voltage drop and energy loss.
Enhanced Conductivity: Leverages superior conductive properties inherent to high-purity copper substrates, enabling seamless electron mobility critical for high-frequency and high-current applications.
Robust Adhesion: Proprietary adhesive technology delivers durable bonding across heterogeneous surfaces (metals, polymers, ceramics), maintaining cohesive strength under dynamic mechanical stress, thermal cycling, and humidity variations.
EMI/RFI Mitigation: Provides multi-spectrum electromagnetic shielding to attenuate interference across frequencies (EMI/RFI), preventing signal degradation from external sources while suppressing parasitic emissions from internal circuitry.
Flexibility: The overall flexibility of the tape can be adapted to different shapes and curvatures of the surface, easy to use in a variety of complex spaces.
Tips for Use:
Clean surfaces before application for better adhesion.
Solderable versions allow direct soldering for permanent fixes.
Overlap seams for continuous shielding in EMI applications.
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