Ultra-Thin Copper Foil Tape

Ultra-Thin Copper Foil Tape Features

Ultra-Thin Thickness: Thickness typically ranges from 0.02mm-2.5mm, meeting applications with extremely strict spatial requirements.
Excellent Flexibility: Soft texture allows easy bending, folding, winding, and twisting, adapting to complex shapes and surfaces for convenient installation on diverse devices and components.
Superior Conductivity: Features X-Y-Z three-directional conductivity for rapid and stable current transmission, minimizing signal attenuation and interference. Ideal for ultra-thin conductive wire fabrication.
Effective Electromagnetic Shielding: High copper conductivity ensures strong shielding against electromagnetic interference (EMI), categorized into electric signal shielding and magnetic signal shielding, protecting internal components from external fields while preventing radiation leakage.
Strong Adhesion: High-performance adhesive ensures firm bonding on metals, insulating materials, and other substrates, maintaining stability during device operation.

Core Application Areas
Electronics and Electrical Equipment

Ultra-thin copper foil tapes are widely used in transformer coils, circuit board shields, flexible circuits (FPC) and other applications due to their high conductivity and flexibility.
In critical electronic components such as capacitors and battery electrodes, ultra-thin copper foils increase energy density by reducing weight and volume.

Semiconductor Packaging and Heat Dissipation

Ultra-thin copper foil can be used as a heat dissipation material for chip packaging, and its high thermal conductivity (385 W/m-K) helps disperse heat.

New Energy & Energy Storage

Copper foil serves as a fluid collector in lithium-ion batteries (LIBs), and ultrathinning can reduce battery weight and increase energy density. Studies have shown that preparing ultra-thin copper foils can reduce carbon footprint and improve battery performance.

Market Development Trends

Sustained Growth in Demand: With the miniaturization and high-performance evolution of electronic devices, the demand for ultra-thin copper foil tape will continue to rise. Its applications in emerging fields such as 5G communication, artificial intelligence (AI), and the Internet of Things (IoT) will further expand.
Continuous Technological Innovation: To meet diverse industry needs, production technologies for ultra-thin copper foil tape will undergo ongoing innovation. This includes developing products with higher conductivity, thinner thicknesses, enhanced flexibility, superior high-temperature resistance, as well as researching new adhesives and advanced manufacturing processes.
Increasing Environmental Requirements: Under tightening environmental regulations, the production of ultra-thin copper foil tape will prioritize eco-friendliness. Developing halogen-free, low-VOC (volatile organic compounds), and other environmentally compliant products will become a critical trend in the market.