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Electronic Component Grounding Copper Foil Tape

Copper Tape Shielding

This engineered copper-backed adhesive material delivers reliable electrical performance for modern device integration, combining metallurgical precision with advanced polymer science for mission-critical applications.

Technical Profile

  • Layer Architecture: 28g/m² annealed copper substrate (99.95% purity) + proprietary carbon-infused acrylic adhesive matrix
  • Dimensional Specifications: 0.10±0.005mm (H) × 19±0.5mm (W) × 16.5 linear meters
  • Surface Resistivity: <0.015 Ω/sq (ASTM D257)
  • Thermal Operating Window: -54°C to +260°C (MIL-STD-810H compliant)

Electronic Component Grounding Copper Foil Tape Key Features & Benefits

High-Conductivity Copper Foil

  • Made from 28-gram soft copper for excellent electrical conductivity.
    Solder-compatible for secure connections.
    Oxidation-resistant to prevent discoloration and maintain performance.

Electrically Conductive Adhesive

  • Pressure-sensitive acrylic adhesive ensures strong bonding to metals, plastics, and insulating surfaces.
    Maintains continuous electrical conductivity across joints and seams.

Optimal Dimensions for Versatile Use

  • Thickness: 0.10mm | Width: 19mm | Length: 16.5m
    Available in custom sizes for specialized applications.

Wide Temperature Resistance

  • Performs reliably in extreme cold and high-heat environments.
    Easy Application & Removal
    Pre-coated with a removable liner for quick, precise installation.
    Conforms to curved and irregular surfaces without cracking.

Superior EMI/RFI Shielding & Static Control

  • Effectively dissipates static electricity to protect sensitive electronics.
    Blocks electromagnetic interference (EMI) for improved signal integrity.

Durable & Flexible Construction

  • Tear-resistant for long-term use in demanding environments.
    Flexible enough for complex installations (e.g., around corners, joints, and seams).

Electronic Component Grounding Copper Foil Tape Features and Application:

  • EMI Containment: Edge shielding for high-speed PCIe 5.0 connectors and 5G mmWave antenna arrays。
  • ESD Management: Continuous grounding grids for cleanroom workstations (ESD S20.20 compliance)。
  • Hybrid Circuit Repair: Bridging damaged traces in automotive CAN bus systems during field diagnostics。
  • Smart Material Integration: Conductive pathways in foldable displays and stretchable sensor arrays。
  • DIY and Decorative Use: Can be used for creative wall designs. Ideal for art projects, smart home installations and prototyping.
Copper Foil Decorative UsesCopper foil grounding applications

How to Use Grounding Tape

Step 1: Surface Preparation
Clean the substrate to remove dust, oil, and contaminants for maximum adhesion.

Step 2: Mark & Apply the Tape
Use a pencil or chalk to mark the application area.
Peel off the protective liner and firmly press the tape onto the surface.

Step 3: Solder & Ground Connections
For ESD flooring, lay a grid pattern with 600mm spacing.
Solder grounding wires to the tape and connect them to earth grounding points.

Step 4: Test Conductivity
Use a multimeter to ensure proper electrical continuity.

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