This engineered copper-backed adhesive material delivers reliable electrical performance for modern device integration, combining metallurgical precision with advanced polymer science for mission-critical applications.
Technical Profile
High-Conductivity Copper Foil
Electrically Conductive Adhesive
Optimal Dimensions for Versatile Use
Wide Temperature Resistance
Superior EMI/RFI Shielding & Static Control
Durable & Flexible Construction
Step 1: Surface Preparation
Clean the substrate to remove dust, oil, and contaminants for maximum adhesion.
Step 2: Mark & Apply the Tape
Use a pencil or chalk to mark the application area.
Peel off the protective liner and firmly press the tape onto the surface.
Step 3: Solder & Ground Connections
For ESD flooring, lay a grid pattern with 600mm spacing.
Solder grounding wires to the tape and connect them to earth grounding points.
Step 4: Test Conductivity
Use a multimeter to ensure proper electrical continuity.
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